- Package Cooled :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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7 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
1,586
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | ||||
VIEW |
1,825
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | ||||
VIEW |
3,384
In-stock
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | ||||
VIEW |
1,222
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
VIEW |
3,147
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
VIEW |
1,326
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
VIEW |
3,447
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin |