- Part Status :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Material Finish :
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3 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
3,402
In-stock
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Delta Electronics | HEATSINK ASSY INTEL LGA1366 | - | Active | Aluminum | Board Level | Square | 3.543" (90.00mm) | 3.543" (90.00mm) | LGA | Bolt On | 1.004" (25.50mm) | - | - | 0.27°C/W | - | |||
|
VIEW |
2,175
In-stock
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Wakefield-Vette | HEATSINK TO-220 CLIP-ON BLK | 243 | Obsolete | Aluminum | Board Level | Square | 0.800" (20.32mm) | 0.270" (6.86mm) | TO-220 | Clip | 0.800" (20.32mm) | 2.0W @ 78°C | 8.20°C/W @ 400 LFM | 39.00°C/W | Pre-Black Anodized | |||
|
VIEW |
1,162
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | |||
