- Part Status :
- Material :
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- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
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18 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
|
VIEW |
3,402
In-stock
|
Delta Electronics | HEATSINK ASSY INTEL LGA1366 | - | Active | Aluminum | Board Level | Square | 3.543" (90.00mm) | 3.543" (90.00mm) | LGA | Bolt On | 1.004" (25.50mm) | - | - | 0.27°C/W | - | |||
|
VIEW |
2,175
In-stock
|
Wakefield-Vette | HEATSINK TO-220 CLIP-ON BLK | 243 | Obsolete | Aluminum | Board Level | Square | 0.800" (20.32mm) | 0.270" (6.86mm) | TO-220 | Clip | 0.800" (20.32mm) | 2.0W @ 78°C | 8.20°C/W @ 400 LFM | 39.00°C/W | Pre-Black Anodized | |||
|
VIEW |
1,471
In-stock
|
t-Global Technology | IR HEAT SPREADER/EMITTER W/ADH | PH3 | Active | Copper | Heat Spreader | Square | 11.811" (300.00mm) | 11.811" (300.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
|
VIEW |
1,162
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | |||
|
VIEW |
3,328
In-stock
|
t-Global Technology | XL25 CERAMIC 10X10MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - | - | - | |||
|
VIEW |
1,129
In-stock
|
t-Global Technology | IR HEAT SPREADER/EMITTER W/ADH | PH3 | Active | Copper | Heat Spreader | Square | 3.937" (100.00mm) | 3.937" (100.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
|
VIEW |
3,310
In-stock
|
t-Global Technology | IR HEAT SPREADER/EMITTER W/ADH | PH3 | Active | Copper | Heat Spreader | Square | 5.906" (150.00mm) | 5.910" (150.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
|
VIEW |
2,675
In-stock
|
t-Global Technology | XL25 CERAMIC BOARD 40X40X3MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 1.575" (40.00mm) | 1.575" (40.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.118" (3.00mm) | - | - | - | - | |||
|
|
VIEW |
3,089
In-stock
|
t-Global Technology | XL25 CERAMIC BOARD 40X40X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 1.575" (40.00mm) | 1.575" (40.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | - | - | |||
|
VIEW |
1,943
In-stock
|
t-Global Technology | XL25 CERAMIC 20X20MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - | - | - | |||
|
|
VIEW |
2,490
In-stock
|
t-Global Technology | XL25 CERAMIC BOARD 30X30X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | - | - | |||
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|
VIEW |
3,642
In-stock
|
t-Global Technology | XL25 CERAMIC 30X30MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.085" (2.15mm) | - | - | - | - | |||
|
|
VIEW |
1,021
In-stock
|
t-Global Technology | XL25 CERAMIC 20X20MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.089" (2.25mm) | - | - | - | - | |||
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|
VIEW |
826
In-stock
|
t-Global Technology | XL25 CERAMIC BOARD 20X20X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | - | - | |||
|
|
VIEW |
2,060
In-stock
|
t-Global Technology | XL25 CERAMIC 10X10MM W/LI98C ADH | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.089" (2.25mm) | - | - | - | - | |||
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|
VIEW |
2,433
In-stock
|
t-Global Technology | XL25 CERAMIC BOARD 10X10X2MM | XL-25 | Active | Ceramic | Heat Spreader | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | - | 0.079" (2.00mm) | - | - | - | - | |||
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|
VIEW |
3,387
In-stock
|
t-Global Technology | PH3N 100X100X0.07MM W/ADH | PH3n | Active | Copper | Heat Spreader | Square | 3.937" (100.00mm) | 3.937" (100.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.003" (0.07mm) | - | - | - | Polyester | |||
|
VIEW |
1,416
In-stock
|
DFRobot | RASPBERRY PI PURE COPPER HEATSIN | - | Active | Copper | Heat Spreader | Square | 0.472" (12.00mm) | 0.472" (12.00mm) | Raspberry Pi | Thermal Tape, Adhesive (Included) | 0.039" (1.00mm) | - | - | - | - | |||
