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5 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
3,488
In-stock
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Comair Rotron | HEATSINK STAMP 17.8X44.5X9.5MM | - | Obsolete | Aluminum | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 1.750" (44.45mm) | - | TO-220 | Bolt On | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized | ||||
VIEW |
2,584
In-stock
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 500 LFM | Black Anodized | ||||
VIEW |
1,681
In-stock
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized | ||||
VIEW |
3,939
In-stock
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized | ||||
VIEW |
1,263
In-stock
|
Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized |