Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
822802B00000
RFQ
VIEW
RFQ
3,488
In-stock
Comair Rotron HEATSINK STAMP 17.8X44.5X9.5MM - Obsolete Aluminum Board Level Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - TO-220 Bolt On 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
2,584
In-stock
Comair Rotron HEATSINK STAMP 25.4X12.7X30MM - Obsolete Aluminum Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - TO-220 Bolt On and PC Pin 0.500" (12.70mm) 2.0W @ 30°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT4
RFQ
VIEW
RFQ
1,681
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT2
RFQ
VIEW
RFQ
3,939
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT1
RFQ
VIEW
RFQ
1,263
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Obsolete Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
Default Photo
RFQ
VIEW
RFQ
1,503
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 1.025" (26.04mm) 1.005" (25.53mm) - TO-220 Clip and PC Pin 0.610" (15.49mm) 1.5W @ 40°C 5.00°C/W @ 500 LFM 20.00°C/W Tin
Default Photo
RFQ
VIEW
RFQ
2,006
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Aluminum Board Level, Vertical Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - TO-220 Bolt On and PC Pin 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM 15.60°C/W Black Anodized
658-25AB
RFQ
VIEW
RFQ
3,250
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK 658 Active Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Not Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
6021BG
RFQ
VIEW
RFQ
2,471
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 TABS BLACK - Active Aluminum Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) - TO-220 Bolt On and PC Pin 0.500" (12.70mm) 2.0W @ 30°C 5.00°C/W @ 500 LFM 12.50°C/W Black Anodized
658-25ABT4E
RFQ
VIEW
RFQ
1,203
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Active Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Adhesive 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
507002B00000G
RFQ
VIEW
RFQ
3,667
In-stock
Aavid, Thermal Division of Boyd Corporation HEATSINK TO-220 BLK - Active Aluminum Board Level Rectangular, Fins 0.700" (17.78mm) 1.750" (44.45mm) - TO-220 Bolt On 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM 15.60°C/W Black Anodized
658-25ABT3
RFQ
VIEW
RFQ
1,254
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Active Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized
658-25ABT1E
RFQ
VIEW
RFQ
3,636
In-stock
Wakefield-Vette HEATSINK CPU 28MM SQ BLK W/TAPE 658 Active Aluminum Top Mount Square, Pin Fins 1.100" (27.94mm) 1.100" (27.94mm) - BGA Thermal Tape, Adhesive (Included) 0.250" (6.35mm) 2.0W @ 40°C 5.00°C/W @ 500 LFM - Black Anodized