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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Material	Type	Shape	Length	Width	Diameter	Package Cooled	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
GLOBAL STOCKS
	822802B00000	RFQ VIEW	PDF RFQ	3,488 In-stock	Comair Rotron	HEATSINK STAMP 17.8X44.5X9.5MM		-	Obsolete	Aluminum	Board Level	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	TO-220	Bolt On	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	822202B00000	RFQ VIEW	PDF RFQ	2,584 In-stock	Comair Rotron	HEATSINK STAMP 25.4X12.7X30MM		-	Obsolete	Aluminum	Board Level, Vertical	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	TO-220	Bolt On and PC Pin	0.500" (12.70mm)	2.0W @ 30°C	5.00°C/W @ 500 LFM	-	Black Anodized
	658-25ABT4	RFQ VIEW	PDF RFQ	1,681 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	658-25ABT2	RFQ VIEW	PDF RFQ	3,939 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	658-25ABT1	RFQ VIEW	PDF RFQ	1,263 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Obsolete	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	7138DG	RFQ VIEW	PDF RFQ	1,503 In-stock	Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK		-	Active	Copper	Board Level, Vertical	Rectangular, Fins	1.025" (26.04mm)	1.005" (25.53mm)	-	TO-220	Clip and PC Pin	0.610" (15.49mm)	1.5W @ 40°C	5.00°C/W @ 500 LFM	20.00°C/W	Tin
	507002B05300G	RFQ VIEW	PDF RFQ	2,006 In-stock	Aavid, Thermal Division of Boyd Corporation	BOARD LEVEL HEAT SINK		-	Active	Aluminum	Board Level, Vertical	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	TO-220	Bolt On and PC Pin	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Black Anodized
	658-25AB	RFQ VIEW	PDF RFQ	3,250 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Not Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	6021BG	RFQ VIEW	PDF RFQ	2,471 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-220 TABS BLACK		-	Active	Aluminum	Board Level, Vertical	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	TO-220	Bolt On and PC Pin	0.500" (12.70mm)	2.0W @ 30°C	5.00°C/W @ 500 LFM	12.50°C/W	Black Anodized
	658-25ABT4E	RFQ VIEW	PDF RFQ	1,203 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Adhesive	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	507002B00000G	RFQ VIEW	PDF RFQ	3,667 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK TO-220 BLK		-	Active	Aluminum	Board Level	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	TO-220	Bolt On	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Black Anodized
	658-25ABT3	RFQ VIEW	PDF RFQ	1,254 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized
	658-25ABT1E	RFQ VIEW	PDF RFQ	3,636 In-stock	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE		658	Active	Aluminum	Top Mount	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	BGA	Thermal Tape, Adhesive (Included)	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Black Anodized

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