Power Dissipation (Max) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Technology Operating Temperature Mounting Type Package / Case Supplier Device Package Power Dissipation (Max) FET Type FET Feature Drain to Source Voltage (Vdss) Current - Continuous Drain (Id) @ 25°C Rds On (Max) @ Id, Vgs Vgs(th) (Max) @ Id Gate Charge (Qg) (Max) @ Vgs Input Capacitance (Ciss) (Max) @ Vds Drive Voltage (Max Rds On, Min Rds On) Vgs (Max)
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EPC2012
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2,271
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EPC TRANS GAN 200V 3A BUMPED DIE eGaN® Discontinued at Digi-Key Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 125°C (TJ) Surface Mount Die Die - N-Channel - 200V 3A (Ta) 100 mOhm @ 3A, 5V 2.5V @ 1mA 1.8nC @ 5V 145pF @ 100V 5V +6V, -5V
EPC2010
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3,575
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EPC TRANS GAN 200V 12A BUMPED DIE eGaN® Discontinued at Digi-Key Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 125°C (TJ) Surface Mount Die Die - N-Channel - 200V 12A (Ta) 25 mOhm @ 6A, 5V 2.5V @ 3mA 7.5nC @ 5V 540pF @ 100V 5V +6V, -4V
STD5N20LT4
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STMicroelectronics MOSFET N-CH 200V 5A DPAK STripFET™ Active Cut Tape (CT) MOSFET (Metal Oxide) -55°C ~ 150°C (TJ) Surface Mount TO-252-3, DPak (2 Leads + Tab), SC-63 D-Pak 33W (Tc) N-Channel - 200V 5A (Tc) 700 mOhm @ 2.5A, 5V 2.5V @ 50µA 6nC @ 5V 242pF @ 25V 5V ±20V
EPC2047ENGRT
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1,173
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EPC TRANS GAN 200V BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die - N-Channel - 200V 32A (Ta) 10 mOhm @ 20A, 5V 2.5V @ 7mA 10.2nC @ 5V 1050pF @ 100V 5V +6V, -4V
IRLM220ATF
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2,225
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ON Semiconductor MOSFET N-CH 200V 1.13A SOT-223 - Active Cut Tape (CT) MOSFET (Metal Oxide) -55°C ~ 150°C (TJ) Surface Mount TO-261-4, TO-261AA SOT-223-4 2W (Tc) N-Channel - 200V 1.13A (Ta) 800 mOhm @ 570mA, 5V - 15nC @ 5V 430pF @ 25V 5V ±20V
EPC2034
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EPC TRANS GAN 200V 48A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 140°C (TJ) Surface Mount Die Die - N-Channel - 200V 48A (Ta) 10 mOhm @ 20A, 5V 2.5V @ 7mA 8.8nC @ 5V 950pF @ 100V 5V +6V, -4V
EPC2046ENGRT
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RFQ
2,565
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EPC TRANS GAN 200V BUMPED DIE - Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die - N-Channel - 200V 11A (Ta) 25 mOhm @ 20A, 5V 2.5V @ 7mA 3.6nC @ 5V 345pF @ 100V 5V +6V, -4V
EPC2010C
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3,289
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EPC TRANS GAN 200V 22A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (7-Solder Bar) - N-Channel - 200V 22A (Ta) 25 mOhm @ 12A, 5V 2.5V @ 3mA 5.3nC @ 5V 540pF @ 100V 5V +6V, -4V
EPC2019
RFQ
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3,004
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EPC TRANS GAN 200V 8.5A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die - N-Channel - 200V 8.5A (Ta) 50 mOhm @ 7A, 5V 2.5V @ 1.5mA 2.5nC @ 5V 270pF @ 100V 5V +6V, -4V
EPC2012C
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1,857
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EPC TRANS GAN 200V 5A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (4-Solder Bar) - N-Channel - 200V 5A (Ta) 100 mOhm @ 3A, 5V 2.5V @ 1mA 1.3nC @ 5V 140pF @ 100V 5V +6V, -4V