Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,455
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,382
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Amphenol FCI CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,743
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
AR32-HZL/07-TT
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2,428
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR32-HZL/01-TT
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1,702
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
A32-LCG-T-R
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2,944
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) - - -
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1,025
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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2,516
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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3,567
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CNC Tech CONN IC DIP SOCKET 32POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,702
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CNC Tech CONN IC DIP SOCKET 32POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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772
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CNC Tech CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,281
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CNC Tech CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
A32-LC-TR
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697
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -55°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
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1,210
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CNC Tech CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
AR 32 HZL/01-TT
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1,578
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR32-HZL/07-TT-R
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638
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Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,355
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,487
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CNC Tech CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole, Kinked Pin Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) 32 (2 x 16) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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2,806
In-stock
CNC Tech CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 32 (2 x 16) Phosphor Bronze 100.0µin (2.54µm) Phosphor Bronze
A 32-LC-TT
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967
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Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -55°C ~ 85°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Tin - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze