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- Housing Material :
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- Liquid Crystal Polymer (LCP) (1)
- Plastic (1)
- Polyamide (PA), Nylon (1)
- Polybutylene Terephthalate (PBT) (7)
- Polybutylene Terephthalate (PBT), Glass Filled (6)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (82)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (106)
- Polyester (13)
- Polyester, Glass Filled (7)
- Polyphenylene Sulfide (PPS) (1)
- Thermoplastic (9)
- Thermoplastic, Glass Filled (4)
- Thermoplastic, Polyester (4)
- Thermoplastic, Polyester, Glass Filled (3)
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256 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,455
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,137
In-stock
|
TE Connectivity Potter & Brumfield Relays | CONN IC DIP SOCKET 32POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | - | 32 (2 x 16) | Copper Alloy | - | - | |||
|
|
VIEW |
1,382
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,262
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 32 (2 x 16) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
1,224
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | - | 32 (2 x 16) | Copper Alloy | - | - | |||
|
|
VIEW |
1,373
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
2,743
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TINLEAD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
960
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
2,809
In-stock
|
3M | CONN IC DIP SOCKET 32POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,428
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,702
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,592
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 32 (2 x 16) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
966
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
3,389
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,350
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
849
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin-Lead | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
944
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,743
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,944
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 32 (2 x 16) | - | - | - | |||
|
|
VIEW |
1,025
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
VIEW |
2,516
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,471
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Decoupling Capacitor | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
3,075
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,112
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,684
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 101 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,377
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,547
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,351
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,892
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
