- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (152)
- Polybutylene Terephthalate (PBT), Glass Filled (6)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (15)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (1)
- Polyester, Glass Filled (27)
- Polyphenylene Sulfide (PPS), Glass Filled (60)
- Thermoplastic (3)
- Thermoplastic, Polyester (1)
- Thermoplastic, Polyester, Glass Filled (3)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 114 (13 x 13) (2)
- 12 (2 x 6) (1)
- 124 (13 x 13) (1)
- 128 (13 x 13) (1)
- 132 (14 x 14) (3)
- 133 (14 x 14) (1)
- 14 (2 x 7) (13)
- 145 (15 x 15) (1)
- 16 (2 x 8) (16)
- 160 (15 x 15) (1)
- 168 (17 x 17) (2)
- 169 (17 x 17) (1)
- 175 (16 x 16) (1)
- 18 (2 x 9) (16)
- 20 (2 x 10) (19)
- 2011 (47 x 58) (3)
- 22 (2 x 11) (4)
- 24 (2 x 12) (39)
- 241 (18 x 18) (2)
- 28 (2 x 14) (40)
- 32 (2 x 16) (22)
- 36 (2 x 18) (8)
- 391 (18 x 18) (1)
- 40 (2 x 20) (22)
- 42 (2 x 21) (8)
- 44 (2 x 22) (8)
- 48 (2 x 24) (10)
- 50 (2 x 25) (4)
- 6 (2 x 3) (4)
- 64 (2 x 32) (4)
- 68 (11 x 11) (2)
- 8 (2 x 4) (8)
- 84 (12 x 12) (1)
- 85 (11 x 11) (1)
- Contact Material - Mating :
- Pitch - Post :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
270 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,601
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 168POS GOLD | - | Obsolete | Bulk | - | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 168 (17 x 17) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Brass | |||
|
|
VIEW |
2,886
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,837
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,605
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,651
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 132POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 132 (14 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
741
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,308
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,716
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 68POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 68 (11 x 11) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,937
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
721
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,531
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,117
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,319
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,211
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
632
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,826
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,200
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
651
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 145POS GOLD | 510 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 145 (15 x 15) | Beryllium Copper | 0.100" (2.54mm) | - | Brass Alloy | |||
|
|
VIEW |
713
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 175POS GOLD | 510 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 175 (16 x 16) | Beryllium Copper | 0.100" (2.54mm) | - | Brass Alloy | |||
|
|
VIEW |
1,518
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,373
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 241POS GOLD | 510 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 241 (18 x 18) | Beryllium Copper | 0.100" (2.54mm) | - | Brass Alloy | |||
|
|
VIEW |
2,946
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
