Contact Finish - Post :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,753
In-stock
Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper 0.050" (1.27mm) - Brass
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3,094
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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RFQ
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2,773
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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RFQ
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3,782
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 279 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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2,332
In-stock
Molex, LLC CONN CAMERA SOCKET 32POS GOLD 105028 Active Bulk -55°C ~ 85°C Surface Mount Solder Open Frame Camera Socket Plastic 0.035" (0.90mm) Gold 12.0µin (0.30µm) Gold 32 (4 x 8) Copper Alloy 0.035" (0.90mm) Flash Copper Alloy
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RFQ
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3,842
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
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3,858
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
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RFQ
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2,601
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Brass
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RFQ
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1,044
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
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3,236
In-stock
Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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VIEW
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876
In-stock
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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RFQ
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2,860
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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1,176
In-stock
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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VIEW
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2,187
In-stock
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,435
In-stock
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,550
In-stock
Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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VIEW
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3,452
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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VIEW
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2,886
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze
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RFQ
VIEW
RFQ
3,837
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze
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RFQ
VIEW
RFQ
3,605
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Phosphor Bronze
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RFQ
VIEW
RFQ
906
In-stock
3M CONN SOCKET PQFP 100POS TIN-LEAD OEM Obsolete Bulk 0°C ~ 105°C Through Hole Solder Open Frame QFP Polyethersulfone (PES), Glass Filled - Tin-Lead 200.0µin (5.08µm) Tin-Lead 100 (4 x 25) Beryllium Copper - 200.0µin (5.08µm) Beryllium Copper
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RFQ
VIEW
RFQ
894
In-stock
Preci-Dip CONN SOCKET PGA 652POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
VIEW
RFQ
3,049
In-stock
Preci-Dip CONN SOCKET PGA 652POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
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RFQ
1,437
In-stock
Preci-Dip CONN SOCKET PGA 600POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
VIEW
RFQ
1,026
In-stock
Preci-Dip CONN SOCKET PGA 600POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
VIEW
RFQ
1,536
In-stock
Preci-Dip CONN SOCKET PGA 576POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 576 (30 x 30) Beryllium Copper 0.050" (1.27mm) Flash Brass
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VIEW
RFQ
3,945
In-stock
Preci-Dip CONN SOCKET PGA 576POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 576 (30 x 30) Beryllium Copper 0.050" (1.27mm) Flash Brass
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VIEW
RFQ
1,650
In-stock
Preci-Dip CONN SOCKET PGA 560POS GOLD 518 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 560 (33 x 33) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
VIEW
RFQ
3,235
In-stock
Preci-Dip CONN SOCKET PGA 560POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 560 (33 x 33) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
VIEW
RFQ
773
In-stock
Preci-Dip CONN SOCKET BGA 652POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 652 (35 x 35) Beryllium Copper 0.100" (2.54mm) - Brass