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5 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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1,072
In-stock
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Apex Microtechnology | CONN IC DIP SOCKET 12POS GOLD | Apex Precision Power® | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 1.2" (30.48mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,710
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 64POS GOLD | HIC | Active | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,262
In-stock
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Apex Microtechnology | CONN SOCKET SIP 20POS GOLD | Apex Precision Power® | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
657
In-stock
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Texas Instruments | CONN TRANSIST TO-3 8POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Polyester, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 8 (Oval) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,775
In-stock
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Apex Microtechnology | CONN TRANSIST TO-3 8POS GOLD | Apex Precision Power® | Active | Bulk | - | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Polyester, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 8 (Oval) | Beryllium Copper | 200.0µin (5.08µm) | Brass |