Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
MS05
RFQ
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RFQ
1,072
In-stock
Apex Microtechnology CONN IC DIP SOCKET 12POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Open Frame DIP, 1.2" (30.48mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
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RFQ
2,710
In-stock
Samtec Inc. CONN IC DIP SOCKET 64POS GOLD HIC Active Tube - Through Hole Solder Open Frame DIP, 0.75" (19.05mm) Row Spacing Polyester, Glass Filled 0.070" (1.78mm) Gold 10.0µin (0.25µm) Gold 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
MS06
RFQ
VIEW
RFQ
1,262
In-stock
Apex Microtechnology CONN SOCKET SIP 20POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Closed Frame SIP Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
0804MC
RFQ
VIEW
RFQ
657
In-stock
Texas Instruments CONN TRANSIST TO-3 8POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass
MS03
RFQ
VIEW
RFQ
1,775
In-stock
Apex Microtechnology CONN TRANSIST TO-3 8POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass