- Part Status :
- Termination :
- Features :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- - (154)
- 10 (2 x 5) (8)
- 12 (2 x 6) (4)
- 14 (2 x 7) (16)
- 16 (2 x 8) (17)
- 18 (2 x 9) (10)
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- 32 (2 x 16) (23)
- 34 (2 x 17) (2)
- 36 (2 x 18) (4)
- 38 (2 x 19) (2)
- 40 (2 x 20) (20)
- 48 (2 x 24) (4)
- 50 (2 x 25) (4)
- 6 (2 x 3) (8)
- 60 (2 x 30) (2)
- 64 (2 x 32) (4)
- 8 (2 x 4) (8)
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297 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,835
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,452
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,874
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,478
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,192
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,740
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,410
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,665
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,705
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,669
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,599
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,888
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,827
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,886
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
952
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,436
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,304
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,077
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
991
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
922
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,285
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,442
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,540
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
769
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,623
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,363
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,373
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,238
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,500
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass |