- Manufacture :
- Part Status :
- Packaging :
- Termination :
- Features :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- - (311)
- 1 (1 x 1) (2)
- 10 (1 x 10) (2)
- 10 (2 x 5) (10)
- 11 (1 x 11) (2)
- 12 (1 x 12) (2)
- 12 (2 x 6) (6)
- 13 (1 x 13) (2)
- 14 (1 x 14) (2)
- 14 (2 x 7) (19)
- 15 (1 x 15) (2)
- 16 (1 x 16) (2)
- 16 (2 x 8) (21)
- 17 (1 x 17) (2)
- 18 (1 x 18) (2)
- 18 (2 x 9) (14)
- 19 (1 x 19) (2)
- 2 (1 x 2) (4)
- 20 (1 x 20) (2)
- 20 (2 x 10) (18)
- 21 (1 x 21) (2)
- 22 (1 x 22) (2)
- 22 (2 x 11) (10)
- 23 (1 x 23) (2)
- 24 (1 x 24) (2)
- 24 (2 x 12) (32)
- 25 (1 x 25) (2)
- 26 (1 x 26) (2)
- 26 (2 x 13) (4)
- 27 (1 x 27) (2)
- 28 (1 x 28) (2)
- 28 (2 x 14) (30)
- 29 (1 x 29) (2)
- 3 (1 x 3) (2)
- 30 (1 x 30) (2)
- 30 (2 x 15) (8)
- 32 (2 x 16) (27)
- 34 (2 x 17) (4)
- 36 (2 x 18) (6)
- 38 (2 x 19) (4)
- 4 (1 x 4) (2)
- 4 (2 x 2) (2)
- 40 (2 x 20) (24)
- 42 (2 x 21) (1)
- 48 (2 x 24) (5)
- 5 (1 x 5) (2)
- 50 (2 x 25) (4)
- 56 (2 x 28) (1)
- 6 (1 x 6) (2)
- 6 (2 x 3) (12)
- 60 (2 x 30) (2)
- 64 (2 x 32) (4)
- 7 (1 x 7) (2)
- 8 (1 x 8) (2)
- 8 (2 x 4) (12)
- 9 (1 x 9) (2)
- Contact Material - Post :
- Applied Filters :
419 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,835
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,452
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,874
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,478
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,192
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,740
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,410
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,665
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,705
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,669
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,599
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,888
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,827
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,886
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
952
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,436
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,304
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,077
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
991
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
922
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,285
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,442
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,540
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
769
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,623
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,363
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,373
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,238
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,500
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,167
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass |