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- Packaging :
- Operating Temperature :
- Mounting Type :
- Housing Material :
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4 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
645
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS TIN | - | Obsolete | Tape & Reel (TR) | - | Surface Mount | Solder | Closed Frame | SIP | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
2,775
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | - | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,591
In-stock
|
Assmann WSW Components | SOCKET 20 CONTACTS SINGLE ROW | - | Active | - | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
657
In-stock
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Texas Instruments | CONN TRANSIST TO-3 8POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Polyester, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 8 (Oval) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
