- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (67)
- DIP, 0.3" (7.62mm) Row Spacing (229)
- DIP, 0.4" (10.16mm) Row Spacing (19)
- DIP, 0.6" (15.24mm) Row Spacing (246)
- DIP, 0.75" (19.05mm) Row Spacing (2)
- DIP, 0.9" (22.86mm) Row Spacing (43)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (103)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (142)
- PGA, ZIF (ZIP) (184)
- PLCC (29)
- SIP (108)
- Transistor, TO-100 (6)
- Transistor, TO-3 (10)
- Transistor, TO-5 (14)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (1)
- Housing Material :
-
- Fluoropolymer (FP) (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (39)
- Polyamide (PA46), Nylon 4/6, Glass Filled (444)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (175)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (61)
- Polyester, Glass Filled (3)
- Polyphenylene Sulfide (PPS) (185)
- Polyphenylene Sulfide (PPS), Glass Filled (289)
- Polytetrafluoroethylene (PTFE) (7)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (5)
- 10 (2 x 5) (44)
- 10 (Round) (4)
- 11 (1 x 11) (3)
- 12 (1 x 12) (4)
- 12 (2 x 6) (27)
- 13 (1 x 13) (3)
- 14 (1 x 14) (4)
- 14 (2 x 7) (44)
- 15 (1 x 15) (4)
- 16 (1 x 16) (5)
- 16 (2 x 8) (49)
- 17 (1 x 17) (3)
- 18 (1 x 18) (2)
- 18 (2 x 9) (27)
- 19 (1 x 19) (2)
- 2 (1 x 2) (9)
- 20 (1 x 20) (7)
- 20 (2 x 10) (34)
- 20 (4 x 5) (4)
- 21 (1 x 21) (3)
- 22 (1 x 22) (2)
- 22 (2 x 11) (21)
- 23 (1 x 23) (2)
- 24 (1 x 24) (2)
- 24 (2 x 12) (79)
- 25 (1 x 25) (2)
- 26 (1 x 26) (2)
- 26 (2 x 13) (15)
- 27 (1 x 27) (4)
- 28 (1 x 28) (2)
- 28 (2 x 14) (68)
- 28 (4 x 7) (4)
- 29 (1 x 29) (2)
- 3 (1 x 3) (3)
- 3 (Oval) (8)
- 3 (Round) (4)
- 30 (1 x 30) (3)
- 30 (2 x 15) (25)
- 31 (1 x 31) (2)
- 32 (1 x 32) (6)
- 32 (2 x 16) (73)
- 32 (2 x 7, 2 x 9) (4)
- 34 (2 x 17) (10)
- 36 (2 x 18) (52)
- 38 (2 x 19) (10)
- 4 (1 x 4) (4)
- 4 (2 x 2) (5)
- 4 (Round) (4)
- 40 (2 x 20) (71)
- 42 (2 x 21) (37)
- 44 (2 x 22) (36)
- 44 (4 x 11) (4)
- 48 (2 x 24) (30)
- 5 (1 x 5) (5)
- 50 (2 x 25) (5)
- 52 (4 x 13) (4)
- 56 (2 x 28) (1)
- 6 (1 x 6) (5)
- 6 (2 x 3) (28)
- 60 (2 x 30) (5)
- 64 (2 x 32) (9)
- 68 (4 x 17) (5)
- 7 (1 x 7) (4)
- 8 (1 x 8) (5)
- 8 (2 x 4) (45)
- 8 (Oval) (2)
- 8 (Round) (8)
- 84 (4 x 21) (4)
- 9 (1 x 9) (3)
- Contact Material - Post :
- Applied Filters :
1205 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
645
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS TIN | - | Obsolete | Tape & Reel (TR) | - | Surface Mount | Solder | Closed Frame | SIP | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,767
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 32POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 32 (2 x 7, 2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,775
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 28POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 28 (4 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,975
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 20POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 20 (4 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,714
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 84POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 84 (4 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,874
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 68POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 68 (4 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,104
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 52POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 52 (4 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,946
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 44POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 44 (4 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,261
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 32POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 32 (2 x 7, 2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,986
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 28POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 28 (4 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,757
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 20POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 20 (4 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,002
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,010
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,180
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,355
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,594
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,608
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,023
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,693
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,994
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,068
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,176
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,719
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,883
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,941
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
