Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,050
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Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,179
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Amphenol FCI CONN SOCKET SIP 2POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,640
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Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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806
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Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,103
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TE Connectivity AMP Connectors CONN SOCKET SIP 2POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 2 (1 x 2) Beryllium Copper - Beryllium Copper
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3,959
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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3,256
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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1,339
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Aries Electronics CONN SOCKET SIP 2POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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3,910
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Aries Electronics CONN SOCKET SIP 2POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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3,985
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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1,535
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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2,993
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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659
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Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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1,503
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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1,477
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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2,539
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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3,218
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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2,874
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Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 2 (1 x 2) Beryllium Copper 10.0µin (0.25µm) Brass
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729
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,366
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,448
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-102-31-018000
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3,949
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 2POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 2 (1 x 2) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,809
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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1,197
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Aries Electronics CONN IC DIP SOCKET 2POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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3,399
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Aries Electronics CONN SOCKET SIP 2POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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2,280
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Aries Electronics CONN SOCKET SIP 2POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-102-41-013000
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1,367
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 2POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
315-47-102-41-003000
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1,631
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 2POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
310-47-102-41-001000
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RFQ
1,337
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 2POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,951
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Aries Electronics CONN SOCKET SIP 2POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass