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- 12 (2 x 6), 6 Loaded (2)
- 12 (5 x 5) (2)
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- 135 (14 x 14) (2)
- 136 (14 x 14) (2)
- 14 (1 x 14) (32)
- 14 (2 x 7) (297)
- 14 (2 x 7), 4 Loaded (3)
- 14 (2 x 7), 8 Loaded (5)
- 142 (15 x 15) (2)
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- 144 (12 x 12) (4)
- 144 (13 x 13) (8)
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- Contact Material - Post :
- Applied Filters :
7779 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
2,753
In-stock
|
Preci-Dip | CONN SOCKET PGA 361POS GOLD | 517 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Tin | 361 (18 x 18) | Beryllium Copper | 0.050" (1.27mm) | - | Brass | |||
|
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,631
In-stock
|
Preci-Dip | CONN SOCKET PGA 281POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 281 (19 x 19) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
|
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,999
In-stock
|
Preci-Dip | CONN SOCKET PGA 279POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 279 (19 x 19) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
|
|
VIEW |
1,472
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Tin | 4 (Round) | Beryllium Copper | - | - | Brass | |||
|
|
VIEW |
3,340
In-stock
|
Harwin Inc. | CONN SOCKET SIP 46POS GOLD | D01-950 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 46 (1 x 46) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
|
|
VIEW |
3,043
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Obsolete | - | - | Through Hole | Solder | Closed Frame | SIP | Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 0.100" (2.54mm) | Flash | Beryllium Copper | |||
|
|
VIEW |
2,601
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 168POS GOLD | - | Obsolete | Bulk | - | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 168 (17 x 17) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Brass | |||
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VIEW |
3,037
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
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VIEW |
3,389
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
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VIEW |
1,036
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 50.0µin (1.27µm) | Silver | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
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VIEW |
1,530
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
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VIEW |
1,882
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Gold | 3 (Round) | Beryllium Copper | - | - | Brass | |||
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VIEW |
2,750
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 10POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin-Lead | 10 (Round) | Beryllium Copper | - | - | Brass | |||
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VIEW |
3,215
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 30POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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VIEW |
2,279
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
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VIEW |
1,455
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
3,835
In-stock
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Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,452
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
VIEW |
1,933
In-stock
|
TE Connectivity AMP Connectors | CONN IC SIP SOCKET 8POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyester | 0.100" (2.54mm) | Gold | - | Tin-Lead | 8 (1 x 8) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
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VIEW |
2,029
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 64POS GOLD | D73064 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, Staggered | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.050" (1.27mm) | Gold | - | Tin | 64 (2 x 32) | Beryllium Copper | 0.050" (1.27mm) | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,044
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
3,236
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
