Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
861
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Obsolete Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,081
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0513-10T
RFQ
VIEW
RFQ
1,188
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,243
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,412
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0517 Active Bulk Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
990
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0518-10H
RFQ
VIEW
RFQ
3,835
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0518-10
RFQ
VIEW
RFQ
2,747
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,324
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass