Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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861
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Obsolete Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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1,383
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Aries Electronics CONN SOCKET SIP 6POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 6 (1 x 6) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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1,850
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Aries Electronics CONN SOCKET SIP 6POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,458
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Aries Electronics CONN SOCKET SIP 6POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,655
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Aries Electronics CONN SOCKET SIP 6POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,106
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Aries Electronics CONN SOCKET SIP 6POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,316
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Aries Electronics CONN SOCKET SIP 6POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,081
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0513-10T
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1,188
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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2,243
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Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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2,412
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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990
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Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0518-10H
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3,835
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Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
06-0518-10
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2,747
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Aries Electronics CONN SOCKET SIP 6POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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1,202
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Aries Electronics CONN SOCKET SIP 6POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,945
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Aries Electronics CONN SOCKET SIP 6POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 6 (1 x 6) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,324
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass