Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,269
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Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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1,802
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper - Brass
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1,792
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Amphenol FCI CONN SOCKET SIP 32POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,367
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Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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3,942
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Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,102
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Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,244
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Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,389
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Amphenol FCI CONN SOCKET SIP 32POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,563
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TE Connectivity AMP Connectors CONN SOCKET SIP 32POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
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3,562
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TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Brass
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3,004
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TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Gold 32 (1 x 32) Beryllium Copper Flash Brass
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1,787
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TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Brass
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3,480
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,372
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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3,927
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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2,179
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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1,613
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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779
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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3,320
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Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
D01-9953242
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1,101
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
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1,801
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,537
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,035
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,578
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Aries Electronics CONN SOCKET SIP 32POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,730
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Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
D01-9973242
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1,254
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass