Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,269
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Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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1,802
In-stock
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper - Brass
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1,792
In-stock
Amphenol FCI CONN SOCKET SIP 32POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,367
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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3,942
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,102
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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2,244
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,389
In-stock
Amphenol FCI CONN SOCKET SIP 32POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,128
In-stock
3M CONN SOCKET SIP 32POS GOLD - Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (1 x 32) - 8.00µin (0.203µm) -
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2,996
In-stock
3M CONN SOCKET SIP 32POS GOLD 300 Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (1 x 32) - 8.00µin (0.203µm) -
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650
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,924
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
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2,076
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C - Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 32 (1 x 32) Beryllium Copper - Beryllium Copper
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2,563
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
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3,562
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Brass
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3,004
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Gold 32 (1 x 32) Beryllium Copper Flash Brass
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RFQ
1,787
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Brass
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RFQ
2,390
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
3,485
In-stock
3M CONN SOCKET SIP 32POS GOLD - Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (1 x 32) - 8.00µin (0.203µm) -
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VIEW
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820
In-stock
3M CONN SOCKET SIP 32POS GOLD 300 Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 32 (1 x 32) - 8.00µin (0.203µm) -
714-93-132-31-018000
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RFQ
2,991
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,152
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 323 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,480
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,372
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,768
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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RFQ
1,986
In-stock
Aries Electronics CONN SOCKET SIP 32POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,729
In-stock
Aries Electronics CONN SOCKET SIP 32POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,508
In-stock
Aries Electronics CONN SOCKET SIP 32POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,713
In-stock
Aries Electronics CONN SOCKET SIP 32POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 32 (1 x 32) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
2,246
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze