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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
1,078
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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VIEW |
3,477
In-stock
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Aries Electronics | CONN SOCKET SIP 20POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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VIEW |
1,404
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | Nickel | |||
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VIEW |
3,365
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | Beryllium Copper | |||
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VIEW |
2,225
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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VIEW |
3,311
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | Beryllium Copper | |||
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VIEW |
3,442
In-stock
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Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | Phosphor Bronze | |||
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VIEW |
853
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | Copper | |||
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VIEW |
2,062
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 20 (2 x 10) | Copper Alloy | Copper Alloy | |||
