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- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (13)
- Polyamide (PA46), Nylon 4/6, Glass Filled (7)
- Polybutylene Terephthalate (PBT) (2)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (5)
- Polyester, Glass Filled (2)
- Thermoplastic, Glass Filled (1)
- Thermoplastic, Polyester (2)
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38 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
988
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,573
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,032
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,975
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,024
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,078
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
1,604
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TIN | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
|
|
VIEW |
994
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,477
In-stock
|
Aries Electronics | CONN SOCKET SIP 20POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,207
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,632
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,404
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | - | Nickel | |||
|
|
VIEW |
1,475
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,581
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,459
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,365
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,286
In-stock
|
CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 20 (2 x 10) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
VIEW |
3,688
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,100
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | 20 (2 x 10) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
|
VIEW |
3,340
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,540
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,225
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,311
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,084
In-stock
|
3M | CONN IC DIP SOCKET 20POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 20 (2 x 10) | Phosphor Bronze | 35.0µin (0.90µm) | Phosphor Bronze | |||
|
|
VIEW |
3,858
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,442
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
853
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | - | Copper | |||
|
|
VIEW |
1,191
In-stock
|
CNC Tech | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 20 (2 x 10) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
1,989
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
