Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
720
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
1,850
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
1,376
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
2,398
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
2,471
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
1,847
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
2,335
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm)
Default Photo
RFQ
VIEW
RFQ
1,982
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS TINLEAD - Active Bulk Through Hole, Right Angle, Horizontal Solder - DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 10 (2 x 5) Beryllium Copper -