Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,236
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD - Obsolete - - Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) 16 (2 x 8) Beryllium Copper 5.00µin (0.127µm) Brass
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2,743
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
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3,517
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 16 (2 x 8) Phosphor Bronze - Phosphor Bronze
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3,483
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 8 (2 x 4) Phosphor Bronze - Phosphor Bronze
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2,548
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TINLEAD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 14 (2 x 7) Phosphor Bronze - Phosphor Bronze
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720
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Brass 200.0µin (5.08µm) Brass
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1,850
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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1,376
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Brass 200.0µin (5.08µm) Brass
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2,398
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Brass 200.0µin (5.08µm) Brass
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2,471
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Brass 200.0µin (5.08µm) Brass
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1,847
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Brass 200.0µin (5.08µm) Brass
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2,335
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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2,590
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Brass
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1,982
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS TINLEAD - Active Bulk - Through Hole, Right Angle, Horizontal Solder - DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 10 (2 x 5) Beryllium Copper - Beryllium Copper