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37 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,849
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,337
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,862
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,583
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,002
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,717
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,492
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,604
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,754
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,793
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,539
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
729
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,366
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,448
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,638
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,718
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,809
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,197
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,399
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,280
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,631
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 2POS GOLD | 315 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,337
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 2POS GOLD | 310 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,951
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
625
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,234
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 2POS GOLD | 316 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,550
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 2POS GOLD | 311 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,201
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,769
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
800
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,618
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
