Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,094
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,828
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,784
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,639
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,002
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,595
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,010
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,398
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,180
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,355
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,594
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,608
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,023
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,693
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,994
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,068
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,176
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,719
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,883
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,941
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,951
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,568
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,992
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,057
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,339
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,617
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,996
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,786
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,874
In-stock
Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,113
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper