Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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1,405
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
16-810-90T
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2,624
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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2,014
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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1,079
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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2,085
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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3,549
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Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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647
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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3,829
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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3,026
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,060
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,924
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
3,597
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,689
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
2,581
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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843
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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3,769
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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2,470
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,776
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,056
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
2,566
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,120
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
3,118
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
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RFQ
2,045
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Aries Electronics CONN IC DIP SOCKET 16POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze