Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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2,829
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TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) 132 (4 x 33) Phosphor Bronze
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663
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Aries Electronics CONN IC DIP SOCKET 48POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze
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1,260
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Aries Electronics CONN IC DIP SOCKET 34POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 34 (2 x 17) Phosphor Bronze
2-822114-4
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871
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TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 160 (4 x 40) Phosphor Bronze
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1,518
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Aries Electronics CONN IC DIP SOCKET 40POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
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1,970
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
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2,321
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Aries Electronics CONN SOCKET SIP 39POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 39 (1 x 39) Phosphor Bronze
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3,759
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Aries Electronics CONN IC DIP SOCKET 36POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze
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2,797
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
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3,326
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
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986
In-stock
Aries Electronics CONN SOCKET SIP 38POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (1 x 38) Phosphor Bronze
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2,101
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Aries Electronics CONN SOCKET SIP 38POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (1 x 38) Phosphor Bronze
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1,236
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Aries Electronics CONN IC DIP SOCKET 28POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze
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3,976
In-stock
Aries Electronics CONN SOCKET SIP 28POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze
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1,901
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Aries Electronics CONN SOCKET SIP 28POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze
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3,509
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Aries Electronics CONN SOCKET SIP 28POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze
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2,466
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Aries Electronics CONN SOCKET SIP 28POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze
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2,728
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Aries Electronics CONN SOCKET SIP 28POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze
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3,535
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Aries Electronics CONN SOCKET SIP 30POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (1 x 30) Phosphor Bronze
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3,963
In-stock
Aries Electronics CONN SOCKET SIP 30POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (1 x 30) Phosphor Bronze
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1,900
In-stock
Aries Electronics CONN IC DIP SOCKET 38POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
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3,869
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Aries Electronics CONN IC DIP SOCKET 48POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze
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2,845
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Phosphor Bronze
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1,504
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Aries Electronics CONN SOCKET SIP 38POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (1 x 38) Phosphor Bronze
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3,794
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Aries Electronics CONN IC DIP SOCKET 24POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze
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3,237
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (2 x 15) Phosphor Bronze
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1,102
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Aries Electronics CONN IC DIP SOCKET 40POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
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949
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
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3,960
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
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3,431
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Aries Electronics CONN SOCKET SIP 31POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 31 (1 x 31) Phosphor Bronze