Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 24POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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742
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,869
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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1,900
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,077
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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3,832
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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3,687
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,215
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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3,942
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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2,187
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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2,149
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,132
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass