Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,758
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Aries Electronics CONN SOCKET SIP 24POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,987
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Aries Electronics CONN SOCKET SIP 24POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 24 (1 x 24) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
714-43-124-31-018000
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2,416
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 24POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (1 x 24) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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742
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,869
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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1,900
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,994
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,834
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,283
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,077
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
224-5809-00-0602
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1,283
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3M CONN SOCKET SIP ZIF 24POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - Gold 24 (1 x 24) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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3,832
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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3,687
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,215
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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2,910
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Harwin Inc. CONN SOCKET SIP 24POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 24 (1 x 24) Beryllium Copper 196.9µin (5.00µm) Brass
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2,729
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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3,942
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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2,187
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (1 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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2,149
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,132
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass