Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,840
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Aries Electronics CONN SOCKET SIP 11POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,270
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,689
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,400
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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602
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,417
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,258
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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3,130
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP - - Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,636
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Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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3,859
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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3,727
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Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass