Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,769
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,273
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,015
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,700
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
714-43-111-31-018000
RFQ
VIEW
RFQ
2,057
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 11POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
805
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,840
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,805
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,270
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,689
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,400
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,179
In-stock
Harwin Inc. CONN SOCKET SIP 11POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 11 (1 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
RFQ
VIEW
RFQ
602
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,417
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,258
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,130
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP - - Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,123
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 11 (1 x 11) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,523
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,636
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,859
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,727
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass