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15 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,025
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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2,302
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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829
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
788
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 28POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 28 (2 x 14) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,589
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,905
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
967
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,933
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,237
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,181
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,051
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,761
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D95 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,378
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,709
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 99POS GOLD | D2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA), Nylon, Glass Filled | 0.200" (5.08mm) | Gold | Flash | Tin | 99 (1 x 99) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
1,100
In-stock
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Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D2 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Plastic | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
