- Series :
-
- - (1045)
- 101 (7)
- 110 (207)
- 111 (22)
- 115 (91)
- 116 (345)
- 117 (6)
- 123 (6)
- 210 (20)
- 4800 (13)
- 500 (55)
- 511 (13)
- 518 (100)
- 600 (1)
- 612 (30)
- 614 (73)
- 8 (251)
- 800 (48)
- Correct-A-Chip® 1109800 (11)
- D2 (8)
- D95 (7)
- DILB (2)
- Diplomate DL (17)
- ED (8)
- EJECT-A-DIP™ (12)
- ICA (19)
- ICO (15)
- Lo-PRO®file, 513 (95)
- SA (15)
- WMS (9)
- XR2 (12)
- Packaging :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (1)
- Plastic (7)
- Polyamide (PA), Nylon (6)
- Polyamide (PA), Nylon, Glass Filled (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (489)
- Polybutylene Terephthalate (PBT) (26)
- Polybutylene Terephthalate (PBT), Glass Filled (40)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (7)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (350)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (498)
- Polyester (46)
- Polyester, Glass Filled (46)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (8)
- Thermoplastic, Polyester (23)
- Thermoplastic, Polyester, Glass Filled (16)
- Pitch - Mating :
- Contact Finish - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (70)
- 12 (2 x 6) (50)
- 12 (2 x 6), 6 Loaded (2)
- 14 (2 x 7) (246)
- 14 (2 x 7), 4 Loaded (3)
- 14 (2 x 7), 8 Loaded (5)
- 16 (2 x 8) (219)
- 16 (2 x 8), 4 Loaded (3)
- 16 (2 x 8), 8 Loaded (8)
- 18 (2 x 9) (139)
- 2 (1 x 2) (1)
- 20 (2 x 10) (181)
- 22 (2 x 11) (69)
- 24 (2 x 12) (126)
- 26 (2 x 13) (14)
- 28 (2 x 14) (96)
- 28 (2 x 14), 14 Loaded (3)
- 28 (2 x 14), 16 Loaded (3)
- 3 (1 x 3) (1)
- 30 (2 x 15) (6)
- 32 (2 x 16) (8)
- 320 (19 x 19) (1)
- 321 (21 x 21) (1)
- 325 (18 x 18) (1)
- 34 (2 x 17) (5)
- 36 (2 x 18) (6)
- 38 (2 x 19) (5)
- 4 (2 x 2) (48)
- 40 (2 x 20) (12)
- 6 (2 x 3) (101)
- 8 (2 x 4) (163)
- 8 (2 x 4), 4 Loaded (1)
- 99 (1 x 99) (1)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1598 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,828
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 3POS GOLD | 800 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 3 (1 x 3) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
|
|
VIEW |
2,031
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS TIN | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 14 (2 x 7) | Beryllium Copper | - | Copper | |||
|
|
VIEW |
720
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,742
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,850
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,851
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
670
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,870
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,312
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 18POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,111
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,016
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,898
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 612 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,548
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,376
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 16 (2 x 8) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 14 (2 x 7) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,471
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 8 (2 x 4) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,769
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
986
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,424
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,539
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,963
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,346
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,785
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,472
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
747
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,046
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,782
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
703
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,550
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,877
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
