Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	64-9503-31	RFQ VIEW	PDF RFQ	3,218 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	64 (2 x 32)	Beryllium Copper	10.0µin (0.25µm)	Phosphor Bronze
	64-9503-21	RFQ VIEW	PDF RFQ	3,867 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	64 (2 x 32)	Beryllium Copper	10.0µin (0.25µm)	Phosphor Bronze
	64-9503-30	RFQ VIEW	PDF RFQ	1,267 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	64-9503-20	RFQ VIEW	PDF RFQ	3,004 In-stock	Aries Electronics	CONN IC DIP SOCKET 64POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	64 (2 x 32)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze

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