- Packaging :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (7)
- DIP, 0.3" (7.62mm) Row Spacing (64)
- DIP, 0.4" (10.16mm) Row Spacing (8)
- DIP, 0.6" (15.24mm) Row Spacing (57)
- DIP, 0.9" (22.86mm) Row Spacing (3)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (103)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (142)
- PGA (7)
- QFP (4)
- SIP (391)
- Transistor, TO-3 (1)
- Pitch - Mating :
- Contact Finish - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (16)
- 10 (2 x 5) (7)
- 11 (1 x 11) (6)
- 12 (1 x 12) (9)
- 13 (1 x 13) (5)
- 132 (4 x 33) (3)
- 14 (1 x 14) (8)
- 14 (2 x 7) (36)
- 15 (1 x 15) (10)
- 16 (1 x 16) (8)
- 16 (2 x 8) (14)
- 160 (4 x 40) (1)
- 17 (1 x 17) (10)
- 18 (1 x 18) (8)
- 18 (2 x 9) (9)
- 19 (1 x 19) (8)
- 2 (1 x 2) (12)
- 20 (1 x 20) (61)
- 20 (2 x 10) (8)
- 21 (1 x 21) (6)
- 22 (1 x 22) (4)
- 22 (2 x 11) (8)
- 23 (1 x 23) (4)
- 24 (1 x 24) (5)
- 24 (2 x 12) (38)
- 25 (1 x 25) (22)
- 26 (1 x 26) (7)
- 27 (1 x 27) (8)
- 28 (1 x 28) (7)
- 28 (2 x 14) (35)
- 29 (1 x 29) (6)
- 3 (1 x 3) (7)
- 3 (Oval) (1)
- 30 (1 x 30) (15)
- 30 (2 x 15) (3)
- 31 (1 x 31) (6)
- 32 (1 x 32) (5)
- 32 (2 x 16) (34)
- 33 (1 x 33) (3)
- 34 (1 x 34) (18)
- 34 (2 x 17) (3)
- 35 (1 x 35) (6)
- 36 (1 x 36) (3)
- 36 (2 x 18) (39)
- 37 (1 x 37) (3)
- 38 (1 x 38) (3)
- 38 (2 x 19) (3)
- 39 (1 x 39) (3)
- 4 (1 x 4) (24)
- 4 (2 x 2) (1)
- 40 (1 x 40) (5)
- 40 (2 x 20) (32)
- 42 (2 x 21) (37)
- 44 (2 x 22) (36)
- 48 (2 x 24) (26)
- 5 (1 x 5) (9)
- 50 (2 x 25) (2)
- 52 (2 x 26) (2)
- 6 (1 x 6) (7)
- 6 (2 x 3) (1)
- 64 (1 x 64) (1)
- 64 (2 x 32) (1)
- 7 (1 x 7) (3)
- 8 (1 x 8) (25)
- 8 (2 x 4) (10)
- 9 (1 x 9) (14)
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
787 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,829
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | 132 (4 x 33) | Phosphor Bronze | Phosphor Bronze | |||
|
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,002
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,010
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,180
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,355
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,594
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,608
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,874
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | Brass | |||
|
|
VIEW |
711
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
658
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,525
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,191
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,914
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,814
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,830
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,623
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,612
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,523
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,753
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,437
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
2,318
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,637
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
3,707
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | Beryllium Copper | |||
|
|
VIEW |
1,192
In-stock
|
Aries Electronics | CONN SOCKET PGA TIN | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | Brass | |||
|
|
VIEW |
3,991
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | Beryllium Copper | |||
