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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
GLOBAL STOCKS
	42-6553-10	RFQ VIEW	PDF RFQ	949 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-6554-11	RFQ VIEW	PDF RFQ	739 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-3554-11	RFQ VIEW	PDF RFQ	3,486 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-6552-11	RFQ VIEW	PDF RFQ	3,634 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-6551-11	RFQ VIEW	PDF RFQ	1,897 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-3553-11	RFQ VIEW	PDF RFQ	3,758 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-3552-11	RFQ VIEW	PDF RFQ	3,345 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper
	42-3551-11	RFQ VIEW	PDF RFQ	2,645 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	42 (2 x 21)	Beryllium Copper

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