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32 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
1,214
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,395
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,882
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
1,586
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,310
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,314
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,144
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,241
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
1,148
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,771
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
1,352
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
1,826
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,508
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
957
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,955
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
1,195
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,215
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
949
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
720
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
790
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,671
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,648
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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|
VIEW |
2,412
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
739
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,486
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
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|
VIEW |
3,360
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,860
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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|
VIEW |
3,634
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
1,897
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,758
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | 42 (2 x 21) | Beryllium Copper | |||
