Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,781
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
778
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,571
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,151
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) 6 (2 x 3) Beryllium Copper Brass
506-AG11D-ESL-LF
RFQ
VIEW
RFQ
2,006
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash 6 (2 x 3) Beryllium Copper Nickel
Default Photo
RFQ
VIEW
RFQ
2,574
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,240
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,369
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,371
In-stock
Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
761
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 6 (2 x 3) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,549
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - 6 (2 x 3) Copper Alloy Copper Alloy