- Mounting Type :
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19 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,781
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
778
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,571
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,151
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 6 (2 x 3) | Beryllium Copper | 25.0µin (0.63µm) | Brass | |||
|
VIEW |
2,006
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 6 (2 x 3) | Beryllium Copper | Flash | Nickel | |||
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|
VIEW |
2,574
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,240
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,369
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,371
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
761
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 6 (2 x 3) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
|
VIEW |
1,908
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,966
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,549
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 6 (2 x 3) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
2,399
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,235
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,820
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,966
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,579
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 6 (2 x 3) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,378
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 6POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
