Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 32POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
232-2601-00-0602
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792
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3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,922
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
D01-9973242
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Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass