Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
650
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,152
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 323 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,480
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,372
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,768
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,246
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,177
In-stock
Aries Electronics CONN SOCKET SIP 32POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
346-43-132-41-013000
RFQ
VIEW
RFQ
3,086
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-99-132-41-013000
RFQ
VIEW
RFQ
1,186
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS TIN-LEAD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
D01-9953242
RFQ
VIEW
RFQ
1,101
In-stock
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
232-2601-00-0602
RFQ
VIEW
RFQ
792
In-stock
3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,922
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-132-41-013000
RFQ
VIEW
RFQ
2,520
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,730
In-stock
Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
D01-9973242
RFQ
VIEW
RFQ
1,254
In-stock
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass