- Part Status :
- Operating Temperature :
- Mounting Type :
- Features :
- Type :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6, Glass Filled (10)
- Polybutylene Terephthalate (PBT), Glass Filled (5)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Polysulfone (PSU), Glass Filled (1)
- Thermoplastic, Polyester (4)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
31 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,802
In-stock
|
Harwin Inc. | CONN SOCKET SIP 32POS GOLD | D01-950 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 32 (1 x 32) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,792
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,367
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,942
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,102
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,244
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,389
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS TIN | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,924
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 32 (1 x 32) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
|
|
VIEW |
2,076
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | - | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 32 (1 x 32) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,563
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 32POS TIN | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Tin | 32 (1 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,562
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 32POS GOLD | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 32 (1 x 32) | Beryllium Copper | 29.5µin (0.75µm) | Brass | |||
|
|
VIEW |
3,004
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 32POS GOLD | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 32 (1 x 32) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,787
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 32POS GOLD | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 32 (1 x 32) | Beryllium Copper | 29.5µin (0.75µm) | Brass | |||
|
|
VIEW |
2,390
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,991
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 32POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,768
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (1 x 32) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,508
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (1 x 32) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,713
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (1 x 32) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,927
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (1 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,179
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (1 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,613
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (1 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
732
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 32 (1 x 32) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
|
|
VIEW |
2,585
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
1,801
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,537
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,035
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
792
In-stock
|
3M | CONN SOCKET SIP ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
2,922
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 32POS GOLD | 310 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,879
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 32POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
|
|
VIEW |
1,578
In-stock
|
Aries Electronics | CONN SOCKET SIP 32POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
