Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,212
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Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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806
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Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,087
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Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,019
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Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,201
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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814
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,597
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,265
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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947
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,947
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,623
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
10-0518-10
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2,645
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,914
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 10POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy