Packaging :
Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,043
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper Flash Beryllium Copper
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3,521
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (1 x 10) Beryllium Copper - Brass
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2,212
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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806
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,087
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,019
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,014
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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942
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 10 (1 x 10) Beryllium Copper 29.5µin (0.75µm) Brass
714-43-110-31-018000
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3,335
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 10POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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2,008
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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2,222
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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2,201
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
3,537
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (1 x 10) Beryllium Copper - Brass
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3,859
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
510-AG90D-10
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3,203
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 10 (1 x 10) Beryllium Copper - Beryllium Copper
1-1571994-0
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1,957
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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814
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,428
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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1,597
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,265
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
947
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
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3,255
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 10 (1 x 10) Beryllium Copper 29.5µin (0.75µm) Brass
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VIEW
RFQ
2,288
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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VIEW
RFQ
1,790
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
2,251
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass
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VIEW
RFQ
1,038
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,959
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 10POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
3,947
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
2,623
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,487
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 10POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass