Contact Finish Thickness - Mating :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
856
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 18 (2 x 9) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,945
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD - Obsolete - - Through Hole, Right Angle, Vertical - Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) -