Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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856
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole, Right Angle, Vertical Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 18 (2 x 9) Beryllium Copper Beryllium Copper
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3,945
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD - Obsolete - - Through Hole, Right Angle, Vertical - Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) - -
1-390262-2
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3,245
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole, Right Angle, Vertical Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze Phosphor Bronze
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RFQ
3,081
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole, Right Angle, Vertical Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze Phosphor Bronze
2-641615-1
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RFQ
863
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper Beryllium Copper
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1,638
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 800 Active Tube -55°C ~ 105°C Through Hole, Right Angle, Vertical Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper Copper