- Series :
- Part Status :
- Operating Temperature :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 14 (2 x 7) (1)
- 16 (2 x 8) (3)
- 18 (2 x 9) (1)
- 20 (2 x 10) (2)
- 24 (2 x 12) (1)
- 28 (2 x 14) (2)
- 3 (Rectangular) (1)
- 32 (2 x 16) (3)
- 32 (4 x 8) (1)
- 34 (1 x 34) (1)
- 34 (2 x 17) (3)
- 35 (1 x 17, 1 x 18) (4)
- 39 (1 x 19, 1 x 20) (2)
- 40 (2 x 20) (1)
- 40 (4 x 10) (2)
- 48 (4 x 12) (3)
- 51 (1 x 25, 1 x 26) (4)
- 68 (4 x 17) (4)
- 8 (2 x 4) (1)
- 90 (2 x 45) (1)
- Applied Filters :
41 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
3,406
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | |||
|
VIEW |
2,908
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | |||
|
VIEW |
1,245
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Discontinued at Digi-Key | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | |||
|
VIEW |
2,161
In-stock
|
3M | CONN IC DIP SOCKET ZIF 40POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
806
In-stock
|
3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
1,267
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
2,639
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
3,079
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
1,594
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
1,340
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
1,425
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
3,872
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
1,541
In-stock
|
3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
2,113
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
2,128
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (1 x 34) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
3,597
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
|
|
VIEW |
941
In-stock
|
3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
|
VIEW |
3,287
In-stock
|
3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 18 (2 x 9) | Beryllium Copper | - | |||
|
|
VIEW |
2,422
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
1,947
In-stock
|
3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
994
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | |||
|
VIEW |
2,942
In-stock
|
3M | CONN SOCKET QFN 48POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | 0.016" (0.40mm) | Gold | - | 48 (4 x 12) | Beryllium Copper | - | |||
|
VIEW |
1,809
In-stock
|
3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
|
|
VIEW |
1,037
In-stock
|
3M | CONN SOCKET QFN 32POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 32 (4 x 8) | Beryllium Copper | - | |||
|
VIEW |
1,560
In-stock
|
3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | - | |||
|
VIEW |
2,685
In-stock
|
3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
|
VIEW |
783
In-stock
|
3M | CONN SOCKET SOIC 14POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 14 (2 x 7) | Beryllium Copper | - | |||
|
VIEW |
884
In-stock
|
3M | CONN SOCKET CLCC 68POS GOLD | OEM | Active | Tray | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | CLCC | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 68 (4 x 17) | Beryllium Copper | 0.100" (2.54mm) | |||
|
VIEW |
2,072
In-stock
|
3M | CONN IC DIP SOCKET ZIF 16POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | |||
|
|
VIEW |
3,945
In-stock
|
3M | CONN SOCKET QFN 48POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | 0.020" (0.50mm) | Gold | - | 48 (4 x 12) | Beryllium Copper | - | |||
